#2881 NORM Product: Removing the cable from CN22 is made more difficult by the solder bump

[Zarro Boogs per Child]

#2881: Removing the cable from CN22 is made more difficult by the solder bump
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 Reporter:  jg                     |       Owner:  vance.ke        
     Type:  defect                 |      Status:  new             
 Priority:  normal                 |   Milestone:  Production Start
Component:  manufacturing process  |     Version:  BTest-4 Hardware
 Keywords:                         |    Verified:  0               
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 See: http://wiki.laptop.org/images/2/25/OLPC_BR_Audit.pdf

 Connectors CN25 and CN26 are identical to CN22. Removing the cables from
 CN25 and CN26 is straight forward. However, removing the cable from CN22
 is made more difficult by the solder bump from a feed through just in
 front of the female end.

 The locking detent feature is a bump on the bottom of the female connector
 and when pulled out, the detent needs to ride up out of its notch and will
 tip the outside edge down. The solder bump interferes with this motion and
 makes it difficult to withdraw. The tendency to pull on the wires rather
 than the connector housing has the potential to damage the connector
 contact pins and/or the housing. This may be a service issue as well as an
 issue on the production line. When the opportunity is available, moving
 this solder bump slightly would be advised.

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Ticket URL: <http://dev.laptop.org/ticket/2881>
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